With the global energy shortage growing trend, green LED energy-saving environmental attention. All countries in the world have formulated their own LED lighting development plans. China's "12th Five-Year Plan" has also clearly described the development goals of LED lighting and listed the LED as a key energy-saving project during the 12th Five-Year Plan. Emerging industries in the energy-saving environmental protection industry and new material industries.
With the development of LED lighting industry, from LED chip production to the lamp market, has formed a relatively perfect industrial chain. But for the traditional LED lighting, from the chip, package, circuit board has been applied, all aspects are relatively independent. Lighting needs of different places, the LED package made a variety of new requirements. How to integrate a variety of technologies within the module, and through the system package approach to LED module package tends to be miniaturized, multi-functional, intelligent has become a problem we need to explore. From a technical point of view, LED is a semiconductor device that easily develops higher value-added products in combination with other semiconductor-related technologies and opens up entirely new markets that traditional lighting can not touch. LED Multi-Function System 3D packaging is a new technology with great market potential that integrates light sources, active and passive electronics , sensors and other components and integrates them into a single, miniaturized system.
LED multi-function package integration technology
Currently, there are some simple LED integrated package products on the market, but the integration level is relatively low, which can not meet the requirement of LED package products on the LED light emitting module in the future. The development trend of the chip module light source embodies the requirements of the lighting market for the development of the technology: the portable products need the light source with higher integration; the integrated LED light source has a great application in the fields of commercial lighting, road lighting, special lighting and flashing lights market. Compared with the package-level module, the chip-scale module is smaller, saves space and saves the packaging cost, and is convenient for the secondary optical design due to the high integration of the light source.
Three-dimensional packaging is developed in recent years, electronic packaging technology. Overall, the important factors that accelerate the application of 3D integrated technology to microelectronic systems include the following aspects:
1. System form factor: reduce system size, reduce system weight and reduce the number of pins;
2. Performance: Improve the integration density, shorten the length of the interconnection, so as to improve the transmission speed and reduce the power consumption;
3. Mass low-cost production: lower process costs, such as the use of integrated packaging and PCB mixed use of programs; simultaneous multi-chip packaging;
4. New applications: such as ultra-small wireless sensors;
There are a variety of different advanced system integration methods currently available, including: package stacking technology on packages; chip stacking on PCBs (wire bond and flip chip); stacked flexible functional layers with embedded devices; with or without Advanced Printed Circuit Board (PCB) Stacking for Embedded Electronics; Wafer Level Chip Integration; Vertical System Integration (VSI) Based on Through Silicon Via (TSV). The benefits of 3D integrated packaging include: Device integration using different technologies (such as CMOS, MEMS, SiGe, GaAs, etc.), "hybrid integration," which often replace shorter two-dimensional interconnects with shorter vertical interconnects Reduced system parasitics and power consumption. Therefore, the three-dimensional system integration technology has great advantages in terms of performance, function and shape. In recent years, various key universities and R & D institutions are developing different kinds of low-cost integrated technologies.
National Key Laboratory of Semiconductor Lighting Joint Innovation LED system for integrated packaging also conducted a systematic study. This research is aimed at LED downlight, through the development of wafer-level packaging technology, plans to drive some of the components and LED chips into the same package. Among them, LED and linear constant current drive circuit die required is the main component of the circuit heat, while the volume is relatively small, easy to integrate, but due to the main heating elements need to consider the thermal design. Other components larger, not easy to integrate. Inductors, sampling resistors and fast recovery diodes, although there is a certain amount of heat generated, but does not require special cooling structure.
Based on the above considerations, we assemble the light-emitting module design as follows:
1. Driver circuit die and LED chip integrated in the package, the rest of the circuit components integrated in the PCB board;
2.PCB circuit boards around the integrated package for easy connection;
3.PCB and integrated package placed on the heat sink;
The advantage of this structure is that: the volume is small; the main heating element contacts with the heat sink directly through the package and is easy to radiate heat; the element which does not need special heat dissipation is placed on a common PCB. Compared with MCPCB, the cost is saved; when needed, the component can be designed on the back of the PCB and hidden in the empty area of ​​the heat sink to avoid the influence of components on the light output.
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